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#364 |
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Mar 2003
Melbourne
5·103 Posts |
I confess - I didn't get first go. Yes I saw the vice method and thought no way. But as crazy as it sounds the vice method is the safest option.
I tried the razor method, it's incredibly hard. I chipped the silicon. The vice method is cake. The only gotcha here - make sure you hold the block of wood firm against the vice and don't let it slip across the chip. I also did this too and knocked off one of the surface mount capacitors. All in all, instead of buying multiple chips and failing, I'd rather have bought 2x systems and underclocked. -- Craig |
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#365 | |
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Mar 2003
Melbourne
5·103 Posts |
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-- Craig |
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#366 | ||
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"Victor de Hollander"
Aug 2011
the Netherlands
23×3×72 Posts |
Quote:
Wikipedia: Quote:
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#367 | |
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Dec 2011
After milion nines:)
1,451 Posts |
Quote:
Try this: is is ultimate thing , have 50-60 % of gallium metal and cannot be used with aluminum heat sinks, but give extreme good results. Temperature will drop at least 10-15°C ( on air cooling systems) |
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#368 | |
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Mar 2003
Melbourne
5·103 Posts |
Quote:
-- Craig |
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#369 |
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Mar 2003
Melbourne
10038 Posts |
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#370 |
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May 2013
East. Always East.
6BF16 Posts |
Is there any need to worry about the electrical conductivity of the thermal paste applied directly to the die? Does Arctic Silver 5 work or do I need a special ceramic based paste or something?
Also, do most heatsinks or waterblocks fit when the IHS is removed, since the setup loses a few millimeters in thickness? Does anyone know if applying a better kind of thermal paste under the IHS and re-mounting with the IHS on provides decent results? I know it would be kind of a shame to go to all that trouble just to re-mount the IHS but it would be a lot safer and maybe easier if the heatsinks can't reach. |
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#371 |
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Mar 2003
Melbourne
5×103 Posts |
No, this is the problem I had.
Due to the mechanical properties of the socket, without the IHS, there are a few mm gap between silicon surface and the cooler. If anyone knows a suitable cooler for a cpu sans IHS, I'm all ears. Generally you'll get better results even with replacing the IHS. (from what I've read). In my mind, if you have a suitable cooler, I'm thinking silicon -> thermal paste -> cooler surface would be more efficient. -- Craig |
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#372 |
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Mar 2003
Melbourne
51510 Posts |
Aaah scratch that.
What I need to do, is remove the 'ILM', the locking mechanism. Page20: http://www.intel.eu/content/dam/www/...cket-guide.pdf The IHS gives extra height to overcome the ILM. Cool, something to try. -- Craig |
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#373 |
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May 2013
East. Always East.
11·157 Posts |
I watched some video of a guy de-lidding. He didn't know what he was doing going into the de-lidding (admittedly) and ended up breaking his IMC so only one of his two DIMM slots worked.
He had to machine the standoffs for his cooler down a few mm as well as taking off the locking mechanism. Some heatsinks go on with an awful lot of pressure but I don't know that many / any of them can do all the way down to the die itself. That coollaboratory ultra stuff looks to be completely bitchin'. I'm going to watercool my PC, probably as a Christmas project. I'm going to leave my GTX 660 Ti on air, though, since it's so cool and quiet and its only purpose is to TF. I'm seriously considering getting some of that Ultra and re-seating all the heatsinks I can find... |
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#374 |
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May 2013
East. Always East.
110101111112 Posts |
Just to bring myself back up to speed, are the Haswell instabilities due to overheating in some regard or is the stress-test failing with incorrect residues or something? I like to keep up with the latest in computer hardware but this whole business is making me feel kind of iffy about Haswell in general.
You had mentioned something about new instructions as well. Is the old version without any instructions changes also unstable? |
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